Intel
BXSTS300C
Intel BXSTS300C, Processor, Heatsink, LGA 3647 (Socket P), Intel® Xeon®, LGA3647 socket, 280 W
SINGLE
Intel BXSTS300C. Suitable for: Processor, Type: Heatsink, Supported processor sockets: LGA 3647 (Socket P). Thermal Design Power (TDP): 280 W. Width: 91 mm, Depth: 88 mm, Height: 64 mm. Package type: Box
computer cooling components
| 343433 | |
| Performance | |
| Suitable for: | Processor |
| Type: | Heatsink |
| Supported processor sockets: | LGA 3647 (Socket P) |
| Compatible processor series: | Intel® Xeon® |
| ARK ID: | 126284 |
| Compatible products: | LGA3647 socket |
| Power | |
| Thermal Design Power (TDP): | 280 W |
| Weight & dimensions | |
| Width: | 91 mm |
| Depth: | 88 mm |
| Height: | 64 mm |
| Packaging content | |
| Package type: | Box |
If you feel like anything is missing in these specifications, don't hesitate to contact us and raise the issue.
